Major: Computer And Systems Engineering, Computer Science
Year: Class of 2017 (Alumni)
This outreach program is geared towards exciting the next generation of manufacturing engineers in the United States. A major component of our outreach work is geared towards taking the micro/nano-scale manufacturing concepts and converting them into the language of Lego. These hands-on Lego modules are then presented to the middle and high-school students. Sponsored by Nano-M3 Design Lab at RPI.